Events

2026 Matter Developer Conference

Join us for the 2026 Matter Developer Conference at IOTE EXPO Shenzhen on August 27, 2026.

The Connectivity Standards Alliance and the Shenzhen IoT Industry Association bring developers, chipmakers and ecosystem partners together for a full day focused on building with Matter.

Sessions cover what’s new in Matter 1.6, updated certification requirements, and commissioning and provisioning tools from Silicon Labs, Nordic, STMicroelectronics and NXP. Speakers will walk through reference implementations for bringing Matter products to market, plus new work connecting Matter with Aliro for access control use cases like smart locks.

Whether you’re shipping your first Matter device or scaling a certified product line, the conference offers direct access to the engineers and standards experts shaping where Matter goes next.

Organized by the Shenzhen IoT Industry Association and the Connectivity Standards Alliance, in cooperation with the Intelligent Communication & Positioning Circle and the Organizing Committee of the IOTE International IoT Exhibition.

Conference Agenda

Time Topic Speaker / Organization Title
13:00‑13:30 Guest Registration & Entry
13:30‑13:55 From Matter 1.5 to 1.6: New Features and Enhancements Amanda Yang Aisa Solutions Architect of Connectivity Standards Alliance
13:55‑14:15 Silicon Labs Brand-New Series 3 Chips & SDK: Redefine Your Matter Development Experience Sky Liu Aisa Ecosystem Senior Manager of Silicon Labs
14:15‑14:35 NFC-Based Matter Device Commissioning with ST25DA-C Donald Chan STM32 Wireless Products Marketing Director, China Region
14:35‑15:00 Latest Updates to the Matter Certification Program: Sunset Rules, Platform Certification & Enhanced Test Tool Capabilities Winnie Hou CMGC Matter Technical Interest Group / TUV Rheinland
15:00‑15:20 nRF Connect SDK × AI Assistant: A Streamlined Workflow for Matter & Aliro Development Kevin Ai Director of Standards and Ecosystems, China Region, Nordic Semiconductor
15:20‑15:40 DAC Secure Flashing & Code-Free Commissioning for Matter Devices Bob Jiang President, Snowball Technology
15:40‑16:10 Out-of-Box Matter MVP Reference Implementation & Commercial Deployment Guide Andy Liu Vice Chair, CMGC Matter Technical Interest Group / HooRii
16:10‑16:35 Enable Seamless Access Control: Implementation Solutions for Locks Based on Matter & Aliro Amigo Li CMGC Matter Technical Interest Group /NXP

Date

Aug 27, 2026

Location

Shenzhen World Exhibition & Convention Center (Bao’an District), Guangdong Province, China